Bambu Lab P1S Heatsink for MC Board
Overview
The P1S Heatsink for MC Board serves the purpose of dissipating heat generated by the MC board. The P1S heatsink is horizontal oriented to work with the control board fan for heat dissipation.
It is also compatible with the P1P 3D Printer and can be used as an upgrade part, if you wish to enclose the printer and add an MC Board fan.
In the Box
1. Heatsink * 12. Silicone Glue * 1
3. Screws * 2
Compatibility
P1 Series
Product Specifications
| Materials | Metal | Packaging Size | 105*54*33 mm |
| Color | Grey | Packaging Weight | 40 g |
Manufacturing company
Shenzhen Tuozhu Technology Co., Ltd
Room 201, Building A, No. 1 First Qianwan Road, Qianhai Shengang Cooperation Zone, Shenzhen
contact@bambulab.com
Room 201, Building A, No. 1 First Qianwan Road, Qianhai Shengang Cooperation Zone, Shenzhen
contact@bambulab.com
Manufacturer's representative in the EU
Bambulab GmbH
Hanauer Landstraße 291b, 60314 Frankfurt am Main 60314 Frankfurt am Main Hanauer Landstrasse 291.
contact@bambulab.com
Hanauer Landstraße 291b, 60314 Frankfurt am Main 60314 Frankfurt am Main Hanauer Landstrasse 291.
contact@bambulab.com
Údaje slouží k naplnění nařízení o obecné bezpečnosti výrobků (GPSR).
