CZ/SK Official Distribution

Bambu Lab H2D Pro

Producer: Bambu Lab Product code: bam_0934
CZ/SK Official Distribution

Bambu Lab H2D Pro

Producer: Bambu Lab Product code: bam_0934

Professional 3D printer with dual nozzles from Bambu Lab.
✔️ Up to 350 ℃ high-temperature printing with dual nozzles
✔️ Additional extruder cooling fan
✔️ Highly durable tungsten carbide nozzle
✔️ Active chamber heating – up to 65 ℃
✔️ Motion accuracy 50 μm
✔️ Ethernet wired connection option
✔️ Physical network power switch (killswitch)
✔️ Supports Wi-Fi WPA2-Enterprise
✔️ Adaptive airflow and HEPA filtration Show more

Professional 3D printer with dual nozzles from Bambu Lab.
✔️ Up to 350 ℃ high-temperature printing with dual nozzles
✔️ Additional extruder cooling fan
✔️ Highly durable tungsten carbide nozzle
✔️ Active chamber heating – up to 65 ℃
✔️ Motion accuracy 50 μm
✔️ Ethernet wired connection option
✔️ Physical network power switch (killswitch)
✔️ Supports Wi-Fi WPA2-Enterprise
✔️ Adaptive airflow and HEPA filtration Show more

In stock 3 pcs
we ship tomorrow
3 960 € inc-vat

Bambu Lab H2D Pro – Professional 3D Printer for Technical Materials

Bambu Lab H2D Pro is an industrial-grade FFF/FDM 3D printer with dual nozzles, designed for reliable printing with high-temperature and abrasive filaments. It features a 350 ℃ nozzle, actively heated 65 ℃ chamber, tungsten carbide nozzles, additional extruder cooling, and enterprise connectivity (Ethernet, WPA2-Enterprise Wi-Fi, physical killswitch).


Key Features:

  • Dual-nozzle printing up to 350 ℃ – stable extrusion for PC, PA-CF, PPA-CF, PPS-CF, etc.

  • Actively heated 65 ℃ chamber – controlled thermal environment, reduced internal stress and warping.

  • Tungsten carbide nozzle (TC) – highly resistant to abrasion from CF/GF composites.

  • Additional extruder cooling fan – consistent performance during long prints.

  • Adaptive airflow + HEPA filtration – effective particle capture and controlled heat removal.

  • Motion accuracy 50 µm – fine mechanical resolution of axis movement.

  • Enterprise connectivity – Ethernet, WPA2-Enterprise (EAP-PEAP), physical network switch.

  • Multi-material / multi-color workflow – dual nozzles and controlled cooling for clean material interfaces.


Printing Materials & Recommended Nozzle Temperatures:

  • ASA ~ 240 ℃

  • ABS ~ 250 ℃

  • PC ~ 270 ℃

  • PET-CF ~ 280 ℃

  • PA6-CF ~ 290 ℃

  • PAHT-CF ~ 300 ℃

  • PPA-CF ~ 310 ℃

  • PPS-CF ~ 340 ℃


Print Chamber & Temperature Control:

  • Active 65 ℃ heating with controlled circulation minimizes temperature gradients.

  • Stable environment reduces warping for high-shrinkage materials (ABS/ASA/PA-CF).

  • Adaptive airflow optimizes heat removal according to print phase.


Extrusion & Nozzle Durability:

  • Tungsten carbide nozzles withstand abrasive CF/GF filaments.

  • Maintains consistent extrusion width and precise details over time.

  • Additional fan stabilizes hotend temperature under continuous load.


Dual-Nozzle Head: Multi-Material & Multi-Color

  • Enables combinations of materials (rigid/composite + breakaway/soluble support) or two colors.

  • Optimized temperature and airflow control reduce material crossover.


Supports & Complex Geometry:

  • Stable chamber environment + precise extrusion → clean support/part interface.

  • Suitable for organic and technical supports for challenging overhangs and cavities.


Filtration & Safety:

  • Adaptive airflow directs fumes according to print phase.

  • HEPA filtration captures fine particles and aerosols from technical polymers.

  • Filter block designed for easy maintenance and media replacement.


Motion Accuracy & Surface Quality:

  • 50 µm mechanical precision, stable perimeters, strong layer adhesion without warping.

  • Ideal for functional parts with high dimensional repeatability.


Connectivity, Management & Network Security:

  • Ethernet for deterministic transfers in corporate LAN.

  • Wi-Fi WPA2-Enterprise (EAP-PEAP) for deployment in enterprise VLANs/SSIDs.

  • Physical network killswitch – instant hard-off without configuration changes.

  • Supported scenarios: file transfer, firmware updates, fleet management.


Recommended Use:

  • Technical parts and prototypes from PC/PA/PEEK alternatives (up to 350 ℃).

  • Carbon fiber (CF) and glass fiber (GF) composites for higher stiffness and strength.

  • Educational and visual models (multi-color), medical models (smooth surfaces, color coding).

  • Small-batch production.

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