Bambu Lab Filament PC 1.75mm, 1kg with spool | Transparentní
Bambu Lab Filament PC 1.75mm, 1kg with spool | Transparentní
Technical polycarbonate filament Bambu Lab PC with a diameter of 1.75 mm and a weight of 1 kg for demanding engineering applications with high thermal and mechanical resistance.
✔️ Nozzle 260 - 280 °C, bed 90 - 110 °C
✔️ Vicat 119 °C, heat deflection 117 °C
✔️ Tensile strength 55 MPa, impact toughness 34.8 kJ/m²
✔️ RFID chip for automatic setup in AMS
✔️ Compatible with AMS 2 Pro, AMS HT, and AMS
✔️ Requires a printer with an enclosed chamber
✔️ High-temperature resistant, reusable spool
✔️ Diameter 1.75 mm ± 0.03 mm, net weight 1 kg Show more
Technical polycarbonate filament Bambu Lab PC with a diameter of 1.75 mm and a weight of 1 kg for demanding engineering applications with high thermal and mechanical resistance.
✔️ Nozzle 260 - 280 °C, bed 90 - 110 °C
✔️ Vicat 119 °C, heat deflection 117 °C
✔️ Tensile strength 55 MPa, impact toughness 34.8 kJ/m²
✔️ RFID chip for automatic setup in AMS
✔️ Compatible with AMS 2 Pro, AMS HT, and AMS
✔️ Requires a printer with an enclosed chamber
✔️ High-temperature resistant, reusable spool
✔️ Diameter 1.75 mm ± 0.03 mm, net weight 1 kg Show more
Product variants
Bambu Lab Filament PC is a technical polycarbonate material designed for demanding engineering applications that require high thermal resistance, mechanical strength, and toughness. The filament is supplied on a 1 kg spool with a diameter of 1.75 mm and an integrated RFID chip for automatic identification in the AMS system.
Key features
Polycarbonate (PC) is one of the durable technical thermoplastics used in 3D printing. It excels in high thermal resistance, with Vicat softening reaching 119 °C and heat deflection 117 °C. The material offers a tensile strength of 55 MPa, flexural strength of 108 MPa, and impact toughness of 34.8 kJ/m², making it a suitable choice for functional parts exposed to mechanical loads. The material density is 1.20 g/cm³. The spool is designed to be high-temperature resistant and reusable.
Technical parameters / specifications
| Parameter | Value |
|---|---|
| Filament diameter | 1.75 mm ± 0.03 mm |
| Nozzle temperature | 260 - 280 °C |
| Bed temperature | 90 - 110 °C (with glue) |
| Print speed | up to 300 mm/s |
| Recommended layer height | 0.1 - 0.28 mm |
| Drying | 80 °C / 8 hours |
| Storage | humidity below 20 % RH, with desiccant |
| Enclosed chamber | required |
| Spool weight with filament | 1 kg |
| Tensile strength | 55 MPa |
| Flexural strength | 108 MPa |
| Impact toughness | 34.8 kJ/m² |
| Vicat softening | 119 °C |
| Heat deflection | 117 °C |
| Density | 1.20 g/cm³ |
| AMS compatibility | AMS 2 Pro, AMS HT, AMS (AMS lite NO) |
Who is Bambu Lab Filament PC 1.75mm, 1kg with spool suitable for
This material is intended for advanced users and professionals who print functional prototypes, structural components, brackets, electronics enclosures, mechanical parts, or components exposed to higher temperatures. Thanks to its high impact resistance, it is suitable for parts subjected to impact loads. Printing PC requires a printer with an enclosed chamber and a heated bed. The recommended print surfaces are the Smooth PEI Plate and Textured PEI Plate, while the Cool Plate and SuperTack are not suitable. For better adhesion, it is recommended to use a glue stick or Bambu Liquid Glue.
Usage tips
- Always thoroughly dry the material before printing - 80 °C for 8 hours in a dryer, or 100 °C for 12 hours on the printer's heated bed.
- Store the filament in a sealed package with desiccant at humidity below 20 % RH.
- Print exclusively in an enclosed chamber to minimize warping and layer delamination.
- For maximum bed adhesion, use glue (glue stick or Bambu Liquid Glue).
- The RFID chip on the spool automatically loads print parameters into the AMS system.
- For higher part strength, increase the number of perimeters and infill to at least 30 - 50 %.
- With transparent PC variants, Lidar Extrusion Calibration may be affected - in that case, turn it off.
- Avoid drafts around the printer to prevent thermal shock and layer cracking.
Room 201, Building A, No. 1 First Qianwan Road, Qianhai Shengang Cooperation Zone, Shenzhen
contact@bambulab.com
Hanauer Landstraße 291b, 60314 Frankfurt am Main 60314 Frankfurt am Main Hanauer Landstrasse 291.
contact@bambulab.com
